And the Apple leaks continue to pour in. A few days back, we got to look at the iPhone 8’s display assembly along with the internal components. With so many news related to the design and specifications (and rumored price) of the iPhone 8, it seems like Apple’s other two products, the iPhone 7s and the iPhone 7s Plus, are being pushed back. We know for sure that iPhone 8 would be powerful. We know that Apple would hone its premium flagship with top of the line specifications and features, while the younger siblings might be closely related to the last year’s iPhone 7 Plus, along with some minor incremental updates.

But then, would everyone be able to afford the 999$’ed iPhone 8? Maybe not. That’s why Apple has the phablet sized iPhone 7s Plus, which would be equally powerful like the iPhone 8. Benjamin Geskin, has given us all a look at the PCB of the alleged iPhone 7s Plus. Though, it would not feature a complete edge-to-edge display, the iPhone 7s Plus would be powered by Apple’s powerful A11 processor, along with Intel LTE modem.

The logic board shared by Benjamin, features a modem by Intel along with the A11 chip. Surprisingly, Intel is one of the two manufacturers that supplies LTE modems to Apple, the other one being Qualcomm.

The iPhone 7s Plus also has a subtle advantage over the iPhone 8, as the bezel-less display would come at the cost. The former’s logic board would use a Substrate-like PCB, which simply means that Apple would connect major components, ranging from the SoC to NAND flash memory and DRAM, by increasing the number of layers while reducing area and width through semiconductor package technology. This would result in an increased efficiency and space, as Apple would be able to bring onboard a better (and bigger) L-shaped battery for the iPhone 7s Plus.

Along with Benjamin Geskin’s tweet, the PCB’s also paid a visit to /Leaks, which were very much in sync to the ones shared by Benjamin.