Huawei has been on a roll of late. The telecom giant recently announced plans to officially unveil its Mate 10 flagship on the 16th of October in Munich, Germany. The chipset at its heart was to be the companies in-house HiSilicon Kirin 970. Today we got a glimpse at the components of the chipset and a confirmation that it has entered mass production.
The leak comes to us courtesy the Chinese micro-blogging site, Weibo where a user shared specifications of the chipset via screenshots. We do not know if these were through a test device or an early prototype of some Huawei handset. The HiSilicon Kirin 970 is built with 64-bit ARM architecture and comes with an octa-core CPU; This will be broken down into two quad-core clusters. One of the clusters is composed of ARM Cortex-A73 cores with a clock frequency of 2.8GHz. The other cluster will likely be composed of Cortex-A53 cores but the peak frequency is unknown. The chipset will support LPDDR4 memory chips with a maximum frequency of 1866MHz and the GPU onboard is a Mali-G72 MP8.
The chipset will be manufactured on TSMC’s 10nm process. On the connectivity front, the LTE modem is compatible with the Cat.12 protocol and supports dual-SIM setups. The Kirin 970 also supports Wi-Fi 802.11 up to the ac standard (dual band 2.4GHz and 5.0GHz). On the Bluetooth front though the chipset is only compatible with v.4.2.
We are expecting to hear more about the chipset and its performance gains vis-à-vis the last generations flagship, the HiSilicon Kirin 960. All would be known as we get closer to the launch of the Huawei Mate 10 though.
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