ASUS ZenFone 4 Max rear

We have been getting regular leaks about the upcoming ASUS ZenFone 4 line of smartphones. The handsets would be revealed on the 17th of August at an event in Taipei, Taiwan; Already we have heard about the ZenFone 4 Selfie and Selfie Pro and the ZenFone 4 Max. Now thanks to @rquandt, tipster extraordinaire we have also received the specifications for the US model of the ZenFone 4 Pro (ZS551KL).

The ZenFone 4 Pro will be the flagship of the line of smartphones. According to the leak, it will feature the Qualcomm Snapdragon 835 SoC coupled with 6GB of RAM and 64GB of internal memory, allegedly expandable via a microSD slot. The smartphone will come with a 5.5-inch full-HD (1080 x1920) display panel. Powering all this hardware is a 3600mAh non-removable battery and even so the smartphone is just ~7.6mm thick. Out of the box, the ZS551KL will be running Android v.7.1, Nougat under ASUS’ proprietary ZenUI skin.

Other features confirmed by this leak are the onboard Bluetooth, which on release will be v.4.2 but an update in the future might bring it to v.5.0. The smartphone will support Wi-Fi up to the ac standard, so dual band support (2.4GHz and 5.0GHz) is confirmed. An NFC module is also present on board.

Read More: ASUS ZenFone 4 appears on Geekbench with Snapdragon 660 and 4GB of RAM

The only specification of note that is omitted from this leak are the camera configurations even though it is pretty much a given that the camera at the rear would be a dual arrangement.

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